Abrasive Grinding

After abrasive cutting, the sectioned sample surface and sub surfaces are damaged. The depth and degree of the damage is very dependent on how the material was sectioned.

The purpose of abrasive grinding is to remove the initial damage caused by the abrasive cut-off blade and to restore the microstructual integrity of the specimen for accurate microscopically analysis.

Please also bear in mind; it is possible to create more damage in grinding rather than in the sectioning step.

For metallographic specimen preparation, silicon carbide, zirconia, alumina & diamond are most commonly used abrasives.

In this newsletter, we will only discuss Silicon Carbide.

SiC is a manufactured abrasive produced by high temperature reaction between Silca & Carbon. Its crystal structure produces a material with a hardness of approximately 2500HV. It is an ideal abrasive for cutting or grinding because of its high hardness & sharp edges. SiC is an excellent abrasive for maximizing cutting rates while minimizing surface & sub surface damage, for metallographic preparation. SiC abrasives are used for coated abrasive grinding paper, ranging from very coarse (60 grit) to very fine (1200 grit) abrasive sizes.

To satisfy all metallographic laboratories financial budgets, MetLab Corp. offers two different quality SiC papers
.

1.      Production Grade

2.      Premium Grade.

Both grades of SiC papers are manufactured here in North America and are adhered to fine paper backing in both Non-PSA & PSA configurations, (PSA- Pressure Sensitive Adhesive)

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