Fine Grinding

The abrasives used for Fine Grinding are Silicon Carbide. General, fixed type abrasives are used, for example, the abrasive grain is bonded to a paper or cloth backing. The bonding material may be glue, or resin. Si C + ALO₂  materials are available with either a non waterproof paper backing with glue or resin bond for dry operation on waterproof paper backing with resin bond for wet or dry operation. The use of Si C abrasive paper is the most efficient and practical technique for grinding metallic metallographic.

METLAB offers both Production and Premium Grade Si C grinding papers in various sizes and shapes to accommodate your grinder/polisher.

Premium Si C powders are processed at higher temperatures than production grade. Thus, the premium Si C powders obtain a more complete reaction between the silica and carbon components.  The resulting crystal structure is a hexagonal structure with a greater hardness. This crystal structure makes the premium Si C paper an ideal abrasive for cutting and grinding because of its high material removal rate.

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First time purchases, will also get a 10% discount as a welcome gift to the single source of Metallographic supplies World Wide.